Sometimes the vias between the layers of the PCB may be pulled off, and sometimes the layers of the PCB may be separated, and even the appearance of the PCB can be seen. In particular, the Z direction of the PCB is the most fragile. ![]() When the speed of heating the PCB is faster, the water vapor expands faster when the temperature is higher, the volume of the water vapor is larger when the water vapor cannot escape from the PCB immediately, there is a good chance to expand the PCB. In addition, after the PCB is produced and placed for a period of time, it has the opportunity to absorb moisture in the environment, and water is one of the main killers that cause PCB popcorn or delamination.īecause when the PCB is placed in an environment with a temperature exceeding 100☌, such as a reflow oven, a wave soldering oven, a hot air leveling or hand soldering process, the water will turn into water vapor, and then rapidly expand its volume. The main purpose of PCB baking is to dehumidify and dehumidify, and to remove the moisture contained in the PCB or absorbed from the outside world, because some materials used in the PCB itself are easy to form water molecules. ![]() ![]() Do you know “why the PCB must be baked before SMT can pass through the reflow oven after the expiration date exceeds the shelf life”?
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